Master Bond EP54TC—is engineered for critical thermal management applications, featuring the highest thermal conductivity.

Heat-sink devices and technology have many aspects, but I am hooked on basic models of varying sizes and fabrication ...

BUFFALO, N.Y. -- A materials engineer at the University at Buffalo has invented a new thermal paste that will help solve the problem of overheating in high-performance personal computers and other ...

A UB materials engineer has invented a new thermal paste that will help solve the problem of overheating in high-performance personal computers and other electronics. Created by Deborah Chung, Niagara ...

Different kinds of materials can play different roles when it comes to controlling heat. If we want to keep our home warm in the depths of winter, insulating layers in our walls can help to lock it in ...