The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets ...

Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

SANTA CLARA, Calif., Sept. 08, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps ...

Invensas, a subsidiary of Xperi, announces DBI Ultra, a die-to-wafer hybrid bonding and 3D interconnect technology that allows known-good die to be bonded to other known-good die for high yielding, ...

TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the focus on HBM products in the DRAM industry is increasingly turning attention toward advanced packaging technologies like hybrid bonding.

SAN JOSE, Calif.--(BUSINESS WIRE)-- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enable high performance computing, edge sensing and AI solutions, today announced that Hamamatsu ...

GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume ...